Resin Bond Diamond Dry&Wet Polishing Pads for Stone(Thickened)

This product series comprises resin bond diamond dry & wet polishing pads for stone (thickened), designed for stone polishing with both dry and wet applications. The range includes multiple models (JP6220310, JP6220410, JP6230310, JP6230410) with diameters of 3″ (80mm) and 4″ (100mm), a standard working thickness of 10mm, and a comprehensive grit range from coarse (#50) to very fine (#3000), catering to various stages of stone polishing from intermediate grinding to fine finishing.

a. Product Features and Advantages:

• Thickened Design: Features a 10mm working thickness, ensuring longer service life and enhanced durability for demanding stone polishing tasks.
• Resin Bonding Process: Utilizes resin bonding to securely attach diamond grains, providing consistent polishing effect and good material adaptability.
• Comprehensive Grit Range: Offers diamond grits from #50 to #3000 (including #50, #100, #200, #400, #800, #1500, #3000), suitable for different polishing stages from coarse grinding to fine finishing.
• Dual-Surface Construction: The working surface (dark olive-green) is embedded with diamond grains for effective abrasion; the reverse side (light grey) has a textured pattern of raised squares and a central indentation, facilitating heat dissipation during use.
• Dry & Wet Versatility: Supports both dry and wet polishing applications, adapting to diverse job site requirements.
• Multiple Model Options: Available in two diameters (3″/80mm and 4″/100mm) across four models, meeting varied polishing area and precision needs.

b. Product Applications:

Ideal for polishing a variety of stone materials including granite, marble, terrazzo, and concrete, providing efficient solutions for stone processing, renovation, and finishing tasks.