Resin Bond Flexible Diamond Wet Polishing Pads forStone (Spiral-grained)

This product series comprises resin bond flexible diamond wet polishing pads with spiral-grained surfaces, designed for wet polishing of stone materials. The range includes multiple models (JP6020303-A, JP6020303, JP6020403-A, JP6020403, JP6020503) with diameters of 3″(80mm), 4″/100mm, and 5″/125mm, a uniform thickness of 3mm, and a comprehensive grit range from coarse (#50) to very fine (#3000) plus BUFF, catering to various stages of the polishing process from initial grinding to final finishing.

a. Product Features and Advantages:

• Resin Bond Process: Ensures high efficiency, long service life, and secure bonding of diamond grains, delivering consistent polishing performance on stone surfaces.
• Spiral-grained Diamond Surface: Features a distinctive spiral-textured abrasive layer that enhances material removal and polishing uniformity.
• Flexibility for Contour Work: Soft and adaptable design allows easy conforming to curved or irregular stone shapes, ideal for detailed polishing.
• Wet Polishing Optimization: Designed for wet use, reducing heat generation and minimizing harmful dust, making the process safer and more environmentally friendly.
• Comprehensive Grit Range: Offers a full spectrum of diamond grits (#50, #100, #200, #400, #800, #1500, #3000, BUFF) to meet diverse material removal and finishing needs.
• Standardized Specifications: Consistent 3mm thickness across all models ensures compatibility with polishing tools; available diameters (3″, 4″, 5″) suit different workpiece sizes.
• Professional Quality: Combines durability with efficient polishing, suitable for both coarse grinding and fine finishing stages.

b. Product Applications:

Ideal for wet polishing a variety of stone materials including granite, marble, and artificial stone. Specifically suited for contour polishing of curved or irregularly shaped stone workpieces, as well as general surface finishing in stone fabrication and renovation projects.